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Ink-jet printer for legends 0.1 mm blind hole plugged with electrolytic Cu White room and Laser Direct
Imaging (LDI)
  Customers of Tecnomaster Group are looking for a continuous attention to technical innovation in every detail of the production process. The whole group is based on very high standards of quality in terms of materials, surface finishes, special technologies and dimensions.

Materials

Surface finishes

Dimensions

Special technologies
  • Standard FR4
  • High-TG and High-CTI FR4
  • Teflon
  • Rogers
  • Arlon
  • Metal core
  • Halogen free
  • Kapton
  • Polymide
  • Ceramics
  • HAL Sn/Pb
  • HAL Lead Free
  • OSP
  • Chemical Ni/Au
  • Galvanic Ni/Au
  • Chemical tin
  • Carbon
  • Minimum line/space:
    50/50 μm
  • Min. Hole size:
    70 μm
  • Max board size:
    800 x 600 mm
  • Max board thickness: 8 mm
  • Max Cu thickness:
    200 μm
  • Aspect ratio: 12:1
  • Blind and buried via’s
  • High density interconnects (HDI)
  • Sequential lamination
  • Controlled Impedance
  • Thick copper
  • Heat sinks
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